Patterns and Circuit BoardConsiderations.. Equipment Impact.. Step Analysis.. Limitations and Issues.. Unbalanced BGA Design.
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Purpose The purpose of this standard is to provide useful and practical information to those who use or are considering using BGAs. The target audiences for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies.
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Focus on Lead-free Defects in the IPC-7095 Revision
Reading time words. The focus of the IPC revision is on lead-free BGAs, land-pattern design and troubleshooting of design- and process-related defects. As the chairman of this committee, I invite your comments as this document goes through this revision. There are two commonly used methods for designing BGA lands - solder-mask-defined and non-solder-mask or copper defined. Solder-mask-defined lands are not desirable because they impact reliability adversely. IPC conducted a survey to determine how prevalent this practice is, the reasons why component suppliers use solder-mask-defined lands and user experience with solder-mask-defined lands. More than individuals responded to the 16 questions regarding solder-mask-defined and metal-defined lands.
IPC-7095C Design and Assembly Process …