2P102A DATASHEET PDF

August General Description. Schottky barrier rectifier in an SO-8 package. This device is designed specifically as a single package. It features a fast. The independently connected.

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August General Description. This device is designed specifically as a single package solution for DC to DC converters. Absolute Maximum Ratings. V DSS. V GSS. Drain Current. Note 1a. Power Dissipation for Dual Operation. Power Dissipation for Single Operation. Note 1b. Note 1c. Operating and Storage Junction Temperature Range. V RRM. Schottky Repetitive Peak Reverse Voltage. Schottky Average Forward Current. Package Marking and Ordering Information.

Device Marking. Reel Size. Tape width. Electrical Characteristics. Test Conditions. Off Characteristics. BV DSS. Drain—Source Breakdown Voltage. Breakdown Voltage Temperature Coefficient. Zero Gate Voltage Drain Current. Gate—Body Leakage, Forward. Gate—Body Leakage, Reverse. On Characteristics. Note 2. GS th. Gate Threshold Voltage. Gate Threshold Voltage Temperature Coefficient. DS on. Static Drain—Source. On—State Drain Current. Forward Transconductance.

Dynamic Characteristics. Input Capacitance. Output Capacitance. Reverse Transfer Capacitance. Switching Characteristics. Turn—On Delay Time. Turn—On Rise Time. Turn—Off Delay Time. Turn—Off Fall Time. Total Gate Charge. Gate—Source Charge. Gate—Drain Charge. Drain—Source Diode Forward Voltage. Schottky Diode Characteristics. Reverse Leakage. Forward Voltage. Thermal Characteristics. Thermal Resistance, Junction-to-Ambient. Thermal Resistance, Junction-to-Case.

Note 1. Scale 1 : 1 on letter size paper. Typical Characteristics. Figure 1. On-Region Characteristics. Figure 2. Figure 3. On-Resistance Variation with Temperature. Figure 4. Figure 5. Transfer Characteristics. Figure 6. Figure 9. Schottky Diode Forward Voltage. Figure 8. Capacitance Characteristics. Figure Schottky Diode Reverse Current. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design. The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

As used herein:. Life support devices or systems are devices or systems which, a are intended for surgical implant into the body, or b support or sustain life, or c whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Definition of Terms. Datasheet Identification. Product Status. Advance Information. Formative or.

This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. In Design. First Production. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

No Identification Needed. Full Production. This datasheet contains final specifications. Not In Production. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

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